See it in action: The 3-dimensional vibratory action coupled with Ultrasonics of this HKC Dual Drive Sifter Series, allowed the customer to sift and separate powdered paint material. Not only did they improve their overall product yield, but they also increased their throughput rate up to 10x with the use of Ultrasonics. 

HKC DUAL DRIVE SIFTER PRODUCT DETAILS

• 24", 30", 36" and 48" screen diameters.

• Its ultra-low profile design allows minimum space consumption making it possible to fit in tight spots between storage and process equipment.

• By mounting the rotary electric vibratory motors on the exterior as opposed to beneath the screening chamber, the overall height is reduced significantly.

• Intended install above or below bulk storage vessels, bulk bag or drum unloaders, blenders, mixers, and other process equipment.

• The unit is designed with a quick screen change system, making it easy to clean in a timely manner.

• Users have the ability to control the residence time of particles on the screen surface by adjusting motor force and orientation angle.

UPGRADE OPTIONS:

• Covers to protect your material from contamination

• Electropolishing to improve the surface finish of your equipment

• Ultrasonics to increase the throughput of your material 3-10x and increases your product yields

• BFM Connectors connect from the inside of your equipment, unlike traditional connectors, which eliminates dust leaks and provides a tighter seal

• Stainless Steel: Food Grade Polished. Reduce corrosion and rust and removes contaminants from the surface of your equipment

HKC DUAL DRIVE SIFTER PRODUCT BENEFITS

• 24", 30", 36" and 48" screen diameters

• Two (2) high-speed rotary electric drives provide rugged 3-dimensional vibratory action

• Low noise levels

• Offers high capacity wet or dry scalping with its low headroom design

• Screen frames designed for quick and low-cost screen replacement

• Unique Ultrasonic transducer design allows for 100% utilization of screen surface

• Ultrasonic vibration use reduces throughput on very fine materials such as diamond dust from hours to minutes

• Used for difficult to screen applications, down to 20 microns