Join the HK Technologies Team at RAPID + TCT heading to Chicago, Illinois from May 2-4, 2024. For more than 30 years, RAPID + TCT has filled a crucial role for the additive manufacturing community, providing conferences, exhibits, and thought leadership that empowers the establishment of the community.
Find out everything you need to know about the latest 3D printing technologies and receive real-world additive manufacturing solutions from industry experts.
HK Technologies will showcase the HKC Series and the Additive Material Sieving Station. Catch up with the Powder Sift Pros and learn how HK Technologies makes sifting operations better.
The HKC Lab Sieve Series offers an economical and low-profile solution for a diverse range of applications such as powder coating reclamation, powdered metals, and food product ingredients.
SEE DETAILSThe HK Ultrasonic Screen Deblinding System can convert your existing gyratory screener, sieve or sifter to to an ultrasonic screener in the matter of minutes, no matter who manufactured it.
SEE DETAILSThe HK Additive Material Sieving Station is a simple, user-friendly ultrasonic sieving station providing quick and easy ultrasonic sieving of AM powder.
SEE DETAILS